The Intel Lakefield platform is not new, we have known about these new processors for a while. But the chip giant has finally detailed these new chips now, providing some welcome technical information.
These are, of course, the chips that will go up against Qualcomm Snapdragon processors. Meaning, these are the ones that are set to power the dual screen and foldable PCs of the future.
In fact, several models sporting these have already been announced. These include the remarkably impressive Lenovo ThinkPad X1 Fold, and a new variant of Samsung Galaxy Book S. Not to mention, Microsoft’s very own Surface Neo, which has now been delayed.
Understandably, the Intel press release does not make even a single mention the Neo.
But the processor itself is stuff that dreams are made of.
The chips have attached package-on-package memory, and native dual-display pipes. And this makes them ideal for dual screen and foldable computers. The package area is 56% smaller, while the board size is 47% smaller when compared to a Core i7-8500Y.
Speaking of, these new CPUs come in Core i5 and i3 variants.
Sure, with a TDP of just 7W, these are not very powerful chips. And this fact is also reflected in the clock speeds of the two models. The Core i3 one goes up to just 0.8 GHz, while the Core i5 manages to run proceedings at 1.4GHz.
The Lakefield platform alternates between big and little cores to manage power. This little trick means that standby power on these processors can be as low as 2.5 mW, which is a 91% reduction compared to the current lowest power CPUs from the Y-series by the company.
You have 5 cores in total, though they do not come with support for Hyperthreading. One of these is a big core, the other four are little ones.
Nevertheless, despite the no show by the Surface Neo, Intel has confirmed that the first devices sporting these Lakefield processors are almost in town.
The Lenovo ThinkPad X1 Fold will ship this year, likely in the summer, while the Galaxy Book S is set for arrival this month.