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Next HoloLens Will Be An Always Connected PC

And guess which chip will power it? Why, the Snapdragon 850, of course. Some interesting new details regarding the next HoloLens have recently surfaced.

To add to the pile of leaks, rumors and announcements from Microsoft itself.

One of which was the claim that the next-generation device will make use of the impressive new Qualcomm Snapdragon XR1 chipset. Well, as it happens, that is not quite true. But the handset will actually be powered by a Snapdragon 850 Mobile Compute Platform.

This, of course, being the same chipset that is found in the recently released Lenovo Yoga C630 and Samsung Galaxy Book 2 devices.

You may naturally be wondering that why Microsoft is not going with the next-generation PC shipset that Qualcomm unveiled last week, the Snapdragon 8cx.

And the answer for that is the fact that HoloLens relies heavily on its Holographic Processing Unit (HPU). The last generation model actually used an Intel Atom as a CPU, and this new model apparently comes with a new HPU that includes an AI coprocessor.

Nevertheless, the next HoloLens will be an Always Connected PC and benefit from the Instant On functionality of the ARM platform.

Snapdragon 850 also has the Snapdragon X20 4G LTE modem built into it, which is capable enough of download speeds of 1.2Gbps. Considering the major enterprise focus of HoloLens, 4G LTE connectivity will allow users to be always connected to the Internet, as they work in the field.

Add in the Windows Core OS on the software side of thing that removes a lot of the legacy part of Windows 10, and next HoloLens should be pretty decked out when it comes to performance.

According to the latest rumors, Microsoft is expected to release its next HoloLens in the second quarter of 2019, as its next standalone holographic PC.

An Always Connected one, at that.

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